Software Quality Assessment based on Lifecycle Expectations

Catégorie : Events

TECHDEBT 2019

The second edition of the TechDebt Conference will be held jointly with ICSE 2019 in Montreal, Canada, May 26–27, 2019. The conference is sponsored by ACM SIGSOFT and IEEE TCSE.

All details are here.

IEEE Sofware Magazine, Nov. 2012, special issue on Technical Debt

Dedicated articles covering all aspects of the Technical Debt paradigm, including « Managing Technical Debt with the SQALE Method ».

Download the accepted paper.

Fièrement propulsé par WordPress & Thème par Anders Norén